Do you compensate artwork for etch factor?

Yes. Trace widths are adjusted per copper weight and dielectric so the finished impedance, not the drawn width, hits the target.

What back-drill stub length can you hold?

0.20 mm as standard and 0.15 mm on advanced builds, confirmed by cross-section.

Can you build hybrid low-loss and FR-4 stack-ups?

Yes. Low-loss layers are bonded to FR-4 cores where only part of the design carries high-speed signals, which keeps cost proportionate to the requirement.

— CAPABILITIES

High-Speed PCB Capability

HyperPCB manufactures high-speed digital PCBs with ±7% controlled impedance, low-loss and hybrid stack-ups, back-drilled stubs and TDR verification on every controlled-impedance lot — up to 48 layers with 50 µm laser vias.

— SPECIFICATIONS

Capability & tolerance chart

High-Speed PCB Capability — standard vs advanced.
Parameter	Standard	Advanced
PCB Types	High-speed, controlled-impedance, high-layer-count, server, networking and optical module boards	—
Layer Count	4 – 48 layers	—
Maximum Board Size	1000 × 600 mm for high-layer-count builds	—
Finished Board Thickness	11.8 – 276 mil for high-layer-count boards	Thicker structures by project review
Minimum Line Width / Spacing	1.97/1.97 mil	1.38/1.38 mil for advanced high-density products
Line Width Tolerance	±0.59 mil for precision signal structures	—
Minimum Mechanical Drill	3.94 – 5.91 mil, depending on structure	—
Through-Hole Aspect Ratio	Up to 20:1	—
Controlled Impedance	±10%	±7% by stack-up, material and design review
High-Speed Signal Support	Up to 128 Gbps class by stack-up and material review	—
Back Drilling	Supported for stub reduction in high-speed channels	—
Via Structures	Through, blind, buried, via-in-pad, resin-plugged, filled and capped vias	—
Advanced Processes	Back drilling, sequential lamination, controlled-depth routing, step grooves, edge plating, embedded copper	—
Materials	Low-loss, high-speed, High Tg FR-4, halogen-free FR-4 and mixed dielectric systems	—

Impedance is a manufacturing outcome

A trace width that models correctly still fails if etch, dielectric thickness and copper roughness are unknown. We work backwards from your target: choose the dielectric we fabricate, compensate the artwork for etch, then measure the result by TDR on coupons from the same panel as your boards.

Via stubs and back drilling

At multi-gigabit rates an unused via stub is a resonator. Where the layer transition allows, back drilling removes the stub to 0.20 mm as standard and 0.15 mm on request, with depth verified on cross-sections.

— FAQ