What is the thickest multilayer board you can build?

12.0 mm finished thickness, subject to layer count, copper weight and drill requirements.

How do you control warp on high layer counts?

By balancing copper across the stack-up at design review, using symmetrical lamination cycles and measuring bow and twist against IPC-6012 on every lot.

Do you provide impedance test reports?

Yes. TDR results for controlled-impedance builds are delivered with the shipment and archived against the lot record.

— CAPABILITIES

Multilayer PCB Capability

HyperPCB manufactures multilayer PCBs up to 48 layers and 1000 × 600 mm, with finished thickness from 0.1 to 12.0 mm, 20:1 through-hole aspect ratio and ±7% controlled impedance, released with 100% AOI on every layer.

— SPECIFICATIONS

Capability & tolerance chart

Multilayer PCB Capability — standard vs advanced.
Parameter	Standard	Advanced
Layer Count	4 – 48 layers	—
Maximum Board Size	1000 × 600 mm	—
Finished Board Thickness	11.8 – 472 mil	Up to 276 mil on high-layer-count builds; thicker by project review
Minimum Line Width / Spacing	2.95/2.95 mil high-reliability production	1.97/1.97 mil for advanced multilayer
Minimum Mechanical Drill	5.91 mil	—
Through-Hole Aspect Ratio	Up to 20:1	—
Controlled Impedance	±10%	±7% by stack-up and design review
Copper Thickness	1 oz / 2 oz standard	Inner up to 12 oz, outer up to 14 oz on heavy copper builds
Lamination Cycles	Multiple lamination cycles supported	—
Via Structures	Through, blind, buried, via-in-pad, resin-plugged, filled and capped vias	—
Special Processes	Back drilling, controlled-depth routing, step grooves, edge plating, half holes, embedded copper	—
Materials	FR-4, High Tg FR-4, halogen-free FR-4, low-loss, high-speed, high-frequency and mixed dielectric systems	—

Stack-up review before tooling

Most multilayer problems are decided before the first panel is cut: dielectric thickness that cannot hit the target impedance, copper balance that guarantees bow and twist, or a via structure that forces an extra lamination cycle. We review the stack-up with you and return a build proposal with the impedance model, not just a price.

Aspect ratio and plating

A 20:1 through hole on a 3 mm board means a 0.15 mm drill plated evenly from end to end. Copper distribution in the barrel is controlled by pulse plating and verified on cross-sectioned coupons from the same panel as your boards.

— FAQ