— CAPABILITIES
PCB Manufacturing Capability
HyperPCB fabricates single-sided through 48-layer boards up to 1000 × 600 mm: 2.5/2.5 mil trace and space standard, 35/35 µm advanced, 0.10 mm drills, 50 µm laser vias, ±7% impedance. Every lot is released with AOI and TDR records.
— SPECIFICATIONS
Capability & tolerance chart
| Parameter | Standard | Advanced |
|---|---|---|
| PCB Types | Single- and double-sided, multilayer, HDI, flexible, rigid-flex, high-frequency, high-speed, heavy copper, metal-core | — |
| Maximum Layer Count | Up to 48 layers | — |
| HDI Capability | 1+N+1, 2+N+2, 3+N+3, 4+N+4, ELIC | Any-layer HDI by project review |
| Maximum Board Size | 1000 × 600 mm | — |
| Finished Board Thickness | 3.94 – 472 mil | Depends on board type and project requirements |
| Minimum Line Width / Spacing | 2.5/2.5 mil standard process | 1.38/1.38 mil for advanced high-density products |
| Minimum Mechanical Drill | 5.91 mil standard production | 3.94 mil for advanced HDI |
| Minimum Laser Via | 2.95 mil standard HDI | 1.97 mil for advanced HDI |
| Through-Hole Aspect Ratio | Up to 20:1 | — |
| Blind Via Aspect Ratio | Up to 1:1 | — |
| Copper Thickness | Inner up to 12 oz / outer up to 14 oz on heavy copper projects | — |
| Controlled Impedance | ±10% | ±7% by stack-up and material review |
| Special Processes | Blind and buried vias, via-in-pad, resin-plugged vias, filled and capped vias, back drilling, controlled-depth routing, step grooves, edge plating | — |
— SURFACE FINISHES
Available surface finishes
One capability chart, not two
The standard column is what we run on production lines every day; the advanced column is what we hold with process controls and longer cycle times. Nothing on this page is a marketing ceiling — if your stack-up sits in the advanced column we will say so in the DFM review and price the extra process steps openly.
Where the tolerances come from
Line width and spacing are set by laser direct imaging rather than film, which removes registration drift across a 1000 × 600 mm panel. Impedance is held by controlling the laminate we fabricate ourselves: dielectric thickness and resin content are known before lamination, so the ±7% window is a measurement we verify by TDR, not an estimate.
What to send for a quote
Gerber RS-274X or ODB++, a drill file, the layer stack-up if you have one, material and finish requirements, quantity and target lead time. If the stack-up is open we will propose one. A mutual NDA can be signed before you upload.
— FAQ
Frequently asked questions
— RELATED
Related capabilities
Ready to build?
Upload your Gerber files for a free DFM review and a quote within 24 hours. Mutual NDA available.