— INDUSTRIES

RF, Microwave & Antenna

HyperPCB builds RF, microwave and antenna boards on laminates it fabricates itself, covering Dk 2.17 to 10.2 with ±7% impedance control and signal integrity verified to 40 GHz.

— CHALLENGES

What this industry demands

Batch-to-batch Dk variation shifting resonant frequency
Long lead times and allocation on premium imported laminate
Loss budget missed because copper roughness was never specified
Hybrid RF and digital stack-ups quoted as two separate builds

— CAPABILITIES

Matching capabilities

High-Frequency PCB Capability

HyperPCB fabricates high-frequency PCBs on laminates it manufactures itself, covering Dk 2.17 to 10.2 with PTFE, hydrocarbon-ceramic and composite substrates, signal integrity verified to 40 GHz and impedance held to ±7%.

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High-Speed PCB Capability

HyperPCB manufactures high-speed digital PCBs with ±7% controlled impedance, low-loss and hybrid stack-ups, back-drilled stubs and TDR verification on every controlled-impedance lot — up to 48 layers with 50 µm laser vias.

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HDI PCB Capability

HyperPCB builds high-density interconnect PCBs from 1+N+1 to 4+N+4 and ELIC, with laser microvias down to 50 µm, 0.10 mm mechanical drills and 1:1 blind via aspect ratio — up to 48 layers with ±7% controlled impedance.

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PCB Manufacturing Capability

HyperPCB fabricates single-sided through 48-layer boards up to 1000 × 600 mm: 2.5/2.5 mil trace and space standard, 35/35 µm advanced, 0.10 mm drills, 50 µm laser vias, ±7% impedance. Every lot is released with AOI and TDR records.

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Ready to build?

Building for rf, microwave & antenna?

Defense-grade production standards, 100% lot traceability, signal integrity verified to 40 GHz.

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