— PCB LAMINATES
Bonding Sheets & Composite Substrates
HyperPCB manufactures prepreg bonding sheets from 0.05 to 0.30 mm with resin content from 40% to 60%, matched to its own laminate families so hybrid and multilayer stack-ups bond with known flow and thickness.
— PROPERTIES
Material properties
| Parameter | Standard |
|---|---|
| Prepreg Thickness | 1.97 – 11.8 mil |
| Resin Content | 40% – 60% |
| Substrates | Prepreg, Composite |
— APPLICATIONS
Typical applications
Microwave circuits needing practical electrical and process behaviourBonding RF layers to FR-4 cores in hybrid stack-upsSequential lamination for HDI buildsThickness-critical multilayer stack-ups
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Need datasheets or a stackup review?
Factory-direct Dk/Df tables, Tg values and stackup guidance from the team that makes the laminate.